辐照
泄漏(经济)
离子
焊剂(冶金)
分析化学(期刊)
物理
材料科学
原子物理学
电气工程
化学
量子力学
有机化学
工程类
宏观经济学
经济
冶金
作者
Chao Peng,Zhifeng Lei,Zhangang Zhang,Yiqiang Chen,Yujuan He,Bin Yao,Yunfei En
标识
DOI:10.1109/tns.2022.3166521
摘要
Radiation-induced leakage current degradations for SiC power MOSFETs are investigated by 181 Ta ion irradiation. An ion flux-related leakage degradation is reported for the first time. It is manifested as a more significant leakage current under higher flux irradiation than that under low flux irradiation, even though the total fluence is the same. Emission microscope (EMMI) results show that more leakage paths are formed for high flux irradiation. The drain bias during irradiation is another key fact to affect the radiation-induced leakage degradation. The leakage only occurs when the drain bias is larger than 300 V for flux = 1000/cm $^{2}\cdot \text{s}$ irradiation. An interesting phenomenon is that although radiation-induced leakage is not observed at 200 V with ion flux of 1000/cm $^{2}\cdot \text{s}$ , leakage appears when the ion flux increases to 6000/cm $^{2}\cdot \text{s}$ . A multi-ion interaction theory is proposed to explain the above phenomenon. The mechanisms of these phenomena are also proved by TCAD simulations.
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