The solar cell wafer shall be subjected to internal connections and external packaging to form a solar cell module. This chapter introduces the structure, material, equipment, packaging process and tests after packaging of the crystalline silicon solar cell modules. Compared with the crystalline silicon solar cell modules, the thin film solar cell modules have simpler packaging process, which is similar to that of the crystalline silicon solar cell but usually integrated to the cell production. It shall be noted that removal of the bubbles in EVA is the key to successful packaging during lamination because the oxygen reacted by the air entered in lamination with the EVA is the main reason for bubble formation. The solar cell module, the minimal component that can offer DC power supply in the market, has internal connections and packaging. The solar cell array shall assemble many solar cell modules together.