Advancements in Through Glass Via (TGV) Technology

Glass provides many opportunities for advanced packaging. The material properties give many opportunities. As an insulator, glass provides advantages in providing low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks. Forming processes allow the potential to both form in panel format as well as to form at thicknesses as low as 100 um, giving opportunities to provide cost-effective solutions for the industry. Via fabrication technology development continues to advance providing via diameters < 20 um in size in production ready environment. [1–5] As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. There also continues to be increasing amounts of data showing the ability to achieve electrical and thermo-mechanical reliability of substrates with TGV and latest data here will also be provided.