收发机
光子学
光电二极管
硅光子学
光电子学
材料科学
发射机
CMOS芯片
比克莫斯
带宽(计算)
计算机科学
电气工程
光链路
光纤
光子集成电路
晶体管
电压
电信
工程类
频道(广播)
作者
Stefan Meister,Moritz Grehn,Hanjo Rhee,Marco Vitali,Christoph Theiss,Sebastian Kupijai,Aws Al-Saadi,Danilo Bronzi,Sven Otte,Marvin Henniges,David Selicke,Muhammad Atif,Erik Schwartz,Stefan Lischke,David Stolarek,Andreas Mai,Mehmet Kaynak,H. Richter,Lars Zimmermann
摘要
We report on an ultra-compact co-integrated transmitter and receiver in SiGe BiCMOS technology for short reach optical interconnects. A fully integrated EPIC transceiver chip on silicon photonics technology is described. The chip integrates all photonic and electronic devices for an electro-optic transceiver and has been designed to be testable on wafer-scale. A node-matched diode modulator based on carrier injection is a key building block in the chip design. Its operation performance is presented with respect to insertion loss, signal-to-noise-ratio and power consumption at a 25.78125 Gbit/s in NRZ operation. A novel SiGe based photodetector exhibits a -3 dB bandwidth of up to 70 GHz and a responsivity of >1 A/W. Details are given about the process technology of co-integration of photonic and electronic integrated circuits using both silicon-on-insulator and bulk silicon. The implemented co-integration process requires only few additional process steps, leading to only a slight increase in complexity compared to conventional CMOS and BiCMOS baselines.
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