Solid chamber for satellite electronic modules and evaluation of its heat conduction behavior

A novel solid chamber configuration for cooling satellite electronic modules enduring high heat is proposed. Solid chamber modules with different inner structures and solid materials with high thermal conductivity are designed, and their thermal performances were experimentally studied. The equivalent heat conduction coefficient and contact thermal resistance of a solid chamber module are defined and the estimation methods for the thermal behavior are proposed. It is found that the thermal performances of the two solid chamber modules with the inner structures respectively composed of Graphite/Al 630/30 composites and graphite plate are obviously better than those of the other modules. Based on the assessment of the thermal resistance and cracks generated in the modules after thermal tests, it is found that the powder metallurgy technology makes the interlayers bonded more tightly than diffusion welding in the manufacture of solid chamber, and the tightness of the interlayer interface plays a key role in the contact thermal resistance.