材料科学
粉末冶金
微观结构
原材料
烧结
放电等离子烧结
可靠性(半导体)
热等静压
临界电流
氢化镁
超导电性
粒子(生态学)
金属粉末
工艺工程
沉积(地质)
3D打印
冶金
高能
粒径
纳米技术
颗粒
导线
化学气相沉积
SPARK(编程语言)
复合材料
导电体
陶瓷
研磨
制作
作者
Jingzheng Cao,Minghui Minghui,Shuyu Yao,Penghong Hu,Jincheng Cao,Dongliang Wang,Yanwei Ma
标识
DOI:10.1088/1361-6668/ae6983
摘要
Abstract REBa 2 Cu 3 O 7− δ (REBCO) high-temperature superconductors exhibit considerable promise for high-power applications. Bulk materials fabricated via powder metallurgy, in particular, are frequently employed as targets for coated conductor deposition and in energy storage applications. This review outlines recent progress in REBCO powder synthesis and densification technologies. In powder synthesis, recent advances in solid-state reaction methods are reviewed, focusing on the effects of raw materials and grinding processes on the final material properties. Meanwhile, chemical synthesis routes including sol–gel, citrate pyrolysis, co-precipitation, PVP-assisted pyrolysis, microwave synthesis, and electrospinning-sol–gel hybrids stand out due to their proven capacity to improve compositional homogeneity, reduce particle size, and minimize agglomeration. The discussion on densification technologies outlines their historical and ongoing evolution. It covers established compaction approaches like die pressing, hot pressing, and isostatic pressing, while also highlighting the field’s transition toward advanced methods including spark plasma sintering and three-dimensional printing. Through a comparative analysis of their technical features and consequent effects on microstructures and superconducting properties, the advantages and limitations of different processing routes are clarified. This review also presents a methodological framework for REBCO characterization, evaluating solid experimental standards while examining prevalent issues. It systematically details the essential techniques and critical parameters involved in each processing stage, from powder analysis to sintered body evaluation, in order to ensure reliability and reproducibility in both fundamental research and application development.
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