Low-Melting-Point Alloy Continuous Network Construction in a Polymer Matrix for Thermal Conductivity and Electromagnetic Shielding Enhancement

Electronic devices require effective thermal dissipation capacity to maintain the working temperature in a safe range. Meanwhile, electromagnetic interference shielding (EMI SE) performance of electronic packaging material becomes critically important due to the broad frequency band of electronic components in the era of 5G communication. To address the above-mentioned issue, a low-melting-point alloy (LMPA) was introduced to poly(vinylidene fluoride) (PVDF) matrix as a novel electronic packaging material. The obtained composite exhibits a continuous LMPA network structure partly wrapped by PVDF microspheres. When loading of LMPA reached 50%, the composite showed a thermal conductivity of 6.38 Wm–1K–1, which was nearly a 2774% increase compared to that of pure PVDF resin. Meanwhile, excellent EMI SE performance was also achieved synchronously, and the total EMI SE was −68.79 dB at 10 GHz. This study is promising to broaden the application of LMPA in the fields of thermal management and EMI SE.