热传导
电阻随机存取存储器
蛋白质丝
电阻式触摸屏
电流(流体)
材料科学
扩散
半径
肖特基二极管
凝聚态物理
工程物理
光电子学
物理
电气工程
计算机科学
电极
二极管
工程类
热力学
量子力学
复合材料
计算机安全
作者
Arya Lekshmi Jagath,Hock Leong Chee,T. Nandha Kumar,HaiderA.F. Almurib
标识
DOI:10.1049/joe.2018.5234
摘要
This article presents a review of physical, analytical, and compact models for oxide‐based RRAM devices. An analysis of how the electrical, physical, and thermal parameters affect resistive switching and the different current conduction mechanisms that exist in the models is performed. Two different physical mechanisms that drive resistive switching; drift diffusion and redox which are widely adopted in models are studied. As for the current conduction mechanisms adopted in the models, Schottky and generalised hopping mechanisms are investigated. It is shown that resistive switching is strongly influenced by the electric field and temperature, while the current conduction is weakly dependent on the temperature. The resistive switching and current conduction mechanisms in RRAMs are highly dependent on the geometry of the conductive filament (CF). 2D and 3D models which incorporate the rupture/formation of the CF together with the variation of the filament radius present accurate resistive switching behaviour.
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