Silicon oxynitride films are prepared by plasma enchanced chemical vapor deposition (PECVD) mothod. The reactant is de-posited on the crystal silicon wafers and quartz. Annealing at temperature 600℃, 700℃, 800℃, 900℃ for half an hour, oxidation at temper-ature 600℃, 700℃, 800℃, 900℃, 1000℃ for twenty minutes, strong blue light (440nm) and ultraviolet light (360nm) emission from silicon oxynitride film at room temperature have been observed. The PL mechanism is analyzed and discussed.