Low-melting Phthalonitrile Oligomers: Preparation, Polymerization and Polymer Properties

A series of low-melting phthalonitrile oligomers were prepared in which variable-length multiple aromatic ether linkages interconnect the terminal phthalonitrile units. These materials were designed to address the need for a processable resin system with good high-temperature properties. The melt-processable oligomers are obtained using a modified-Ullman ether reaction between a bisphenol and a dihalobenzene to form a hydroxyl-terminated oligomeric intermediate that is endcapped by reaction with 4-nitrophthalonitrile. Viscosity measurements show that the phthalonitrile oligomers are polymerized at a moderate temperature (200°C) using the typical aromatic diamine curing additives, bis[4-(4-aminophenoxy)phenyl]sulfone and 1,3-bis(3-aminophenoxy)benzene. The oligomeric phthalonitrile/diamine mixtures exhibit a low complex melt viscosity (0.01-0.1 Pa s) at 200°C. Differential scanning calorimetric analysis is used to follow the polymerization as the oligomeric phthalonitrile/diamine mixtures are heated to elevated temperatures. Thermal and dynamic mechanical properties of thermally-cured oligomeric phthalonitrile polymers are systematically evaluated and compared with those of two other high temperature thermosetting phthalonitrile polymers, 4,4~-bis(3,4-dicyanophenoxy)biphenyl and 1,3- bis(3,4-dicyanophenoxy)benzene. After thermal treatment at 425°C for 8 h, the oligomeric phthalonitrile polymers exhibit char yields of 70% when heated to 1000°C in flowing nitrogen and decomposition temperatures in excess of 500°C when heated in either flowing nitrogen or air. Rheometric measurements indicate that the fully cured oligomeric phthalonitrile polymers do not soften or exhibit a glass transition temperature upon heating to 450°C. Overall, studies on the phthalonitrile oligomers and the corresponding polymers reveal an attractive combination of processability, thermal and thermo-oxidative stability and good dynamic mechanical properties for these materials