微波食品加热
微电子机械系统
单片微波集成电路
电容感应
电气工程
材料科学
功率(物理)
灵敏度(控制系统)
光电子学
电子工程
工程类
CMOS芯片
电信
物理
放大器
量子力学
作者
Chen Li,Ximing Guo,Aodi Xu,Debo Wang
标识
DOI:10.1088/1361-6439/acf2a6
摘要
Abstract To improve the sensitivity and dynamic range of microwave power sensors, a micro-electromechanical system (MEMS) dual-channel microwave power sensor is proposed in this study. The sensor is designed and manufactured using the GaAs monolithic microwave integrated circuit` (MMIC) process and MEMS technology. The microwave performance, overload power and sensitivity are theoretically studied. At 8–12 GHz, the return loss of the sensors with three different fixed beam sizes are approximately −10 dB, which is good microwave performance. The sensitivities for capacitive detection channel of the two sensors with larger sizes are 2.4 fF W −1 @10 GHz and 14.5 fF W −1 @10 GHz, respectively, and the sensitivities of the thermoelectric detection channel of the three sensors is 25.7 mV W −1 , 24.9 mV W −1 and 24.2 mV W −1 , respectively. Compared with traditional microwave power sensors, the sensor proposed takes into account the advantages of microwave power sensors in both thermoelectric and capacitive structures. This work helps lay the foundation for the design of microwave power sensors with a fixed beam structure and thermoelectric microwave power sensors.
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