阈下传导
光电子学
材料科学
肖特基二极管
图层(电子)
肖特基势垒
晶体管
电气工程
纳米技术
电压
工程类
二极管
作者
Xuan Liu,Chao Feng,Danfeng Mao,Yuhao Wang,Rongxin Du,Xiaoping Wang,Haibo Hu,Wei Xue,David Zhou,Yuxi Wan
标识
DOI:10.35848/1347-4065/ada708
摘要
Abstract In this work, the impact of partially depleted and fully depleted p -GaN (PDP-GaN and FDP-GaN) layers on the gate characteristics of Schottky-type p -GaN Gate HEMTs is investigated. Four wafers are fabricated via different annealing temperatures to achieve the PDP-GaN and FDP-GaN layers. Devices with PDP-GaN show nearly identical SS / V TH , while G m,max enhances with increased activated Mg concentration. Meanwhile, the device with FDP-GaN demonstrates higher SS , lower V TH , and specific G m,max compared to the others. It turns out that subthreshold and turn-on characteristics are attributed to the position of the Fermi level in p -GaN and the Schottky tunneling leakage current, respectively.
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