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222 积分 2024-02-27 加入
Application of Ag-Cu-Ti active metal composite filler in ceramic joining: a review
1个月前
已完结
Influence of Sputtering DC Sputtering Power on the Surface Evolution of Ti Thin Films: A Fractal Description
1个月前
已完结
Enhanced adhesion and electrical properties of TiN/Cu metallization on Si3N4 ceramic substrates via magnetron sputtering
1个月前
已完结
Improving film thickness uniformity on curved substrates via planar and cylindrical magnetron sputtering: Simulation and experimental validation
2个月前
已完结
Enhanced adhesion and electrical properties of TiN/Cu metallization on Si3N4 ceramic substrates via magnetron sputtering
2个月前
已完结
Microstructure and mechanical properties of Si3N4/Si3N4 joint brazed with Ag–Cu–Ti+SiCp composite filler
3个月前
已完结
Improvement in Bending Strength of Silicon Nitride through Laser Peening
6个月前
已完结
Strengthening of ceramics by shot peening
6个月前
已完结
Aluminium Nitride Surface Characterization by Grinding with Laser–Ultrasonic Coupling
6个月前
已完结
Effect of Residual Stresses on the Fracture of Ground Ceramics
6个月前
已完结
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