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100 积分 2024-02-27 加入
Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests
2个月前
已完结
A review on the wettability and residual stress of AMB AlN/metal joints
2个月前
已完结
Electrochemical additive manufacturing of copper parts: printed material properties vs. traditionally deposited
6个月前
已完结
Manufacturing of high strength and high conductivity copper with laser powder bed fusion
6个月前
已完结
Additive manufacturing of micro‐architected copper based on an ion‐exchangeable hydrogel
6个月前
已完结
Additive Manufacturing of a Steel–Ceramic Multi-Material by Selective Laser Melting
6个月前
已完结
Thick Film Copper Bonding for Highly Reliable Ag-free MetalCeramic Substrates
9个月前
已完结
Cu patterns with high adhesion strength and fine resolution directly fabricated on ceramic boards by ultrafast laser modification assisted metallization
10个月前
已完结
Transient Thermal Impedance Measurement of HPD Power Modules
10个月前
已完结
A Compact 175°C High Temperature Gate Driver with Isolated Power Supply and Advanced Protection for HybridPACK Drive SiC Module
10个月前
已完结
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