Lv5
1476 积分 2022-06-30 加入
Packaging of photonic integrated circuits (PIC) for sensing and quantum applications
17天前
已关闭
Scalable Fabrication of 3D Optical Re-distribution for Co-Packaged Optics using an Developed Nanoimprint Stepper
17天前
已完结
Transition From MEMS Technology to Nanofabrication
17天前
已完结
Packaging of photonic integrated circuits (PIC) for sensing and quantum applications
18天前
已关闭
Enabling three-dimensional architected materials across length scales and timescales
1个月前
已完结
Updates of nanoimprint lithography for production and applications for next generation memory devices
1个月前
已完结
Nanoimprint lithography performance advances for new application spaces
1个月前
已完结
Optimization of NIL and associated pattern transfer processes for the fabrication of advanced devices
1个月前
已完结
Nanoimprint performance improvements for high volume semiconductor device manufacturing
1个月前
已完结
Development of silicon photonics process using UV nanoimprinting
1个月前
已完结
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