Lv4
710 积分 2025-10-30 加入
Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
1个月前
已完结
Brittle-ductile transition mechanism during grinding 4H-SiC wafer considering laminated structure
1个月前
已完结
Enhanced Precision Lapping Techniques for Fused Quartz Optical Elements: Synergistic Integration of Mechanical and Mechanochemical Processes
1个月前
已完结
Investigation of a green nanofluid added with graphene and Al2O3 nano-additives for grinding hard-to-cut materials
1个月前
已完结
Study on electromagnetic stirring–braking structure layout design and its synergistic mechanism in electromagnetic metallurgy
1个月前
已完结
Ultra-precision lapping of H2O(g) plasma-treated CaF2 by porous diamond grits
1个月前
已完结
Grain wear properties and grinding performance of porous diamond grinding wheels
1个月前
已完结
Key technologies for laser-assisted precision grinding of 3D C/C-SiC composites
1个月前
已完结
Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon
1个月前
已完结
Scalable and reproducible sub-5 nm manufacturing for next-generation devices
1个月前
已关闭
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