Lv4
710 积分 2021-02-20 加入
Interconnect Stack using Self-Aligned Quad and Double Patterning for 10nm High Volume Manufacturing
2个月前
已完结
Damascene Benchmark of Ru, Co and Cu in Scaled Dimensions
2个月前
已完结
Impact of Liner Metals on Copper Resistivity at Beyond 7nm Dimensions
2个月前
已完结
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
2个月前
已完结
PVD Cu Reflow Seed Process Optimization for Defect Reduction in Nanoscale Cu/Low-k Dual Damascene Interconnects
2个月前
已完结
Cleaning of High Aspect Ratio STI Structures for Advanced Logic Devices by Implementation of a Surface Modification Drying Technique
2个月前
已完结
Overview of interconnect technology for 7nm node and beyond - New materials and technologies to extend Cu and to enable alternative conductors (invited)
2个月前
已完结
Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects
2个月前
已完结
Interconnect technologies and materials for logic at 2 nm and beyond
2个月前
已完结
Interconnect technologies and materials for logic at 2nm and beyond
2个月前
已关闭
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