Lv51
850 积分 2021-02-20 加入
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
1小时前
已完结
Reliability degradation impact by ultra low-k dielectrics and improvement study for BEOL process beyond 28nm technology
1小时前
已完结
Dielectric and Scaling Effects on Electromigration for Cu Interconnects
1个月前
已完结
Reinforcement in electromigration reliability of Cu interconnects by alloying of extremely dilute MnO
1个月前
已完结
Postvoiding FEM Analysis for Electromigration Failure Characterization
1个月前
已完结
In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
1个月前
已完结
Multi-phase-field modelling of electromigration-induced void migration in interconnect lines having bamboo structures
1个月前
已完结
CVD Co capping layers for Cu/low-k interconnects: Cu EM enhancement vs. Co thickness
1个月前
已完结
Multi-Physics Simulation of Electromigration in Cu Interconnect
1个月前
已完结
A physics-based electromigration model for advanced interconnects
1个月前
已完结
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