Lv11
58 积分 2025-09-16 加入
High Aspect Ratio (AR) Through Glass Via (TGV) Etch Performance on Glass Core Substrates for High Density 3D Advanced Packaging Applications
1小时前
已完结
A Review of Glass Substrate Technologies
1个月前
已完结
高性能封装玻璃基板TGV技术的研究现状、挑战与未来展望
1个月前
已完结
Thermal and Electrical Study of Glass Interposers in Co-Packaged Electronic–Photonic Systems
1个月前
已完结
Numerical simulation on the warpage of reconstructed wafer during encapsulation process
2个月前
已完结
Warpage Optimization of Manufacturing Process for Fan-out Chip on Substrate-Bridge
2个月前
已完结
Innovative Sub-5-$\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects
2个月前
已完结
Large-body-sized Glass-based Active Interposer for High-Performance Computing
2个月前
已完结
Glass interposer for heterogeneous integration of flip-chipped photonic and electronic integrated circuits
2个月前
已完结
Research on Integration of Photonic and Electronic Chips Based on Glass Interposer (Invited)
2个月前
已完结
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