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Glass Materials for Advanced Packaging 2025
1天前
求助中
From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems
1天前
已完结
Current Advances and Outlook of Advanced Packaging
2天前
已完结
Development of high performance 2.5D packaging using glass interposer with through glass vias
8天前
已完结
Two-Phase Flow Boiling for Ultra-High Heat Flux SiC Chip Cooling
10天前
已完结
High efficiency single and multi-phase direct liquid jet-impingement cooling for heterogeneous packaging
10天前
已完结
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
1个月前
已完结
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
2个月前
已完结
Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding
2个月前
已完结
Design of surface topography for fabricating nanotwinned copper/polyimide hybrid joints using in-situ heating atomic force microscopy
2个月前
已完结
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