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Optical Multi-Chip Interconnect Bridge (OMIB™) Interposer Assembly Process to Enable High-Density Photonic Interconnects for High-Performance Computing Applications
2个月前
已关闭
Co-designing electronics with microfluidics for more sustainable cooling
2个月前
已完结
High Aspect Ratio (AR) Through Glass Via (TGV) Etch Performance on Glass Core Substrates for High Density 3D Advanced Packaging Applications
3个月前
已完结
A Review of Glass Substrate Technologies
4个月前
已完结
高性能封装玻璃基板TGV技术的研究现状、挑战与未来展望
4个月前
已完结
Thermal and Electrical Study of Glass Interposers in Co-Packaged Electronic–Photonic Systems
4个月前
已完结
Numerical simulation on the warpage of reconstructed wafer during encapsulation process
5个月前
已完结
Warpage Optimization of Manufacturing Process for Fan-out Chip on Substrate-Bridge
5个月前
已完结
Innovative Sub-5-$\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects
5个月前
已完结
Large-body-sized Glass-based Active Interposer for High-Performance Computing
5个月前
已完结
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