| 标题 |
Optical Multi-Chip Interconnect Bridge (OMIB™) Interposer Assembly Process to Enable High-Density Photonic Interconnects for High-Performance Computing Applications |
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期刊:Electronic Components and Technology Conference 作者:A. Aggarwal; Suresh Pothukuchi; Anmol Rathi; S. Sahni; P. Winterbottom; et al 出版日期:2025-05-27 |
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(2025-6-4)