Lv5
918 积分 2025-11-23 加入
A 48Gb/s/lane 1.24Tb/s/mm UCIe-Compliant Die-to-Die Link Over 30mm Standard Package
1个月前
已完结
Signal Integrity Simulation and Analysis for 2.5D Advanced Package Interconnect Based on Universal Chiplet Interconnect Express (UCIe)
1个月前
已完结
Efficient Die-to-Die Communication: UCIe Link Simulation and Optimization in a Chiplet-Based System
1个月前
已完结
Signal Integrity Design and Analysis of Universal Chiplet Interconnect Express (UCIe) Channel in Silicon Interposer for Advanced Package
1个月前
已完结
Signal Integrity Analysis of UCIe Channel in FOCoS Advanced Package
1个月前
已完结
A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET
1个月前
已完结
Extended CPM for system power integrity analysis
8个月前
已完结
A UCIe Interconnect Channel Design Up to 32Gbps on 2.5D Si-Interposer
9个月前
已完结
Signal, Power, and Thermal Integrity Co-Design for AI Accelerator ASIC and HBM3 on Silicon Interposer 2.5D-IC Chiplet Integration
9个月前
已完结
Parametric S-Parameter Prediction Using Deep Learning
9个月前
已完结
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