| 标题 |
Signal Integrity Simulation and Analysis for 2.5D Advanced Package Interconnect Based on Universal Chiplet Interconnect Express (UCIe) |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) 作者:Yuxuan Fan; Hanchen Gan; Yunyan Zhou; Bo Lei; Gang Song; et al 出版日期:2024-12-03 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时,文件已从服务器自动删除,无法下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)