| 标题 |
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa |
| 网址 | |
| DOI |
10.1115/1.4047846
doi
|
| 其它 |
期刊:Journal of Electronic Packaging 作者:Ki Wook Jung; Eunho Cho; Hyoungsoon Lee; Chirag Kharangate; Feng Zhou; et al 出版日期:2020-08-17 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)