Lv11
10 积分 2026-08-08 加入
Characteristics of Ti-Capped Co Films Deposited by a Remote Plasma ALD Method Using Cyclopentadienylcobalt Dicarbonyl
4小时前
已完结
OMCVD of cobalt and cobalt silicide
4小时前
已完结
Process and characteristics of cobalt films deposited by thermal atomic layer deposition and silicide film formed
1天前
已完结
Area Selective Atomic Layer Deposition of Cobalt Thin Films
1天前
已完结
Preliminary growth of metallic co films by thermal atomic layer deposition using RCpCo(CO)2 and alkylamine precursors
1天前
已完结
Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating
1天前
已完结
皖公网安备34019202002308
