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76 积分 2025-05-26 加入
Cryogenic plasma etching for SiO2/SiN dielectric films: a mini review
18天前
已完结
Comparative study of CF4 + X + He (X = C4F8 or C4H2F6) plasmas for high aspect ratio etching of SiO2 with ACL mask
18天前
已完结
Review of sustainable plasma processing for next-generation electronics: from 3D integration to advanced displays
18天前
已完结
Effect of O2 dilution and substrate temperature on the etching of SiNx in a C4F6/Ar plasma
1个月前
已完结
Hydrogen bond-mediated activation of HF in SiO2 thermal dry etching: A first-principles study of catalytic additives
1个月前
已完结
Formation and stability of ammonium fluorosilicate during etching of SiN x in CH2F2/Ar and SF6/H2 plasmas
2个月前
已完结
Hydrogen bond-mediated activation of HF in SiO2 thermal dry etching: A first-principles study of catalytic additives
2个月前
已关闭
Ion energy control in reactive ion etching using 1-MHz pulsed-DC square-wave-superimposed 100-MHz RF capacitively coupled plasma
2个月前
已完结
Effect of gas additives on reaction barriers in cryo etching of silicon oxide and nitride
3个月前
已关闭
Neutral transport during etching of high aspect ratio features
3个月前
已完结