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90 积分 2025-05-26 加入
Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation
1天前
待确认
High aspect ratio silicon etch: A review
6天前
已完结
Exploring the impact of aspect ratio and O2 flow rate on the etch rate ratio of SiO2 at the bottom and top of the trench
1个月前
已完结
Development for high-aspect-ratio hole etching with hydrogen fluoride gas based cryogenic process
2个月前
已关闭
Formation and stability of ammonium fluorosilicate during etching of SiN x in CH2F2/Ar and SF6/H2 plasmas
2个月前
已关闭
Investigation of tilted etching of Si3N4 using CF4/O2 plasma: Process development and mechanism study
5个月前
已完结
Attention-enhanced conditional variational autoencoder integrating 3D plasma etching simulation for etching process optimization
6个月前
已完结
Research on the difference in etching rates of SiO2 at the top and bottom of high-aspect-ratio trench in C4F8/Ar/O2 plasma etching
6个月前
已完结
Carbon Hard Mask Opening Process Development with Novel Sidewall Passivation in Memory Manufacturing
6个月前
已完结
Optimization of Tilted Profile in Ultra-High Aspect Ratio Etch Process for 3D NAND Flash Memory
6个月前
已关闭