Lv2
178 积分 2022-03-17 加入
Evolution Kinetics of Voids in Electroplated Cu-Cu Wafer Bonding
23小时前
求助中
Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias
15天前
已完结
Investigation of Bottom-Up Electrodeposition Filling for Nanoscale Through-Silicon Vias (TSVs)
4个月前
已完结
Effect of Superfilling and Leveling Inhibitors in Hybrid Additives on the Microstructure Evolution of Electroplated Copper Interconnect Films during Self-Annealing
4个月前
已完结
Magnetic–enzymatic synergy driven photoelectrochemical aptasensor on a microfluidic chip for sub-pM kanamycin detection
4个月前
已完结
Magnetic–enzymatic synergy driven photoelectrochemical aptasensor on a microfluidic chip for sub-pM kanamycin detection
4个月前
已完结
FEA study on the TSV copper filling influenced by the additives and electroplating process
5个月前
已完结
FEA study on the TSV copper filling influenced by the additives and electroplating process
5个月前
已关闭
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