Lv2
196 积分 2022-03-17 加入
Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding
3个月前
已完结
Single-additive TSV filling achieved with a tris-ammonium-based suppressor
3个月前
已完结
Evolution Kinetics of Voids in Electroplated Cu-Cu Wafer Bonding
6个月前
已完结
Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias
6个月前
已完结
Investigation of Bottom-Up Electrodeposition Filling for Nanoscale Through-Silicon Vias (TSVs)
10个月前
已完结
Effect of Superfilling and Leveling Inhibitors in Hybrid Additives on the Microstructure Evolution of Electroplated Copper Interconnect Films during Self-Annealing
10个月前
已完结
Magnetic–enzymatic synergy driven photoelectrochemical aptasensor on a microfluidic chip for sub-pM kanamycin detection
11个月前
已完结
Magnetic–enzymatic synergy driven photoelectrochemical aptasensor on a microfluidic chip for sub-pM kanamycin detection
11个月前
已完结
FEA study on the TSV copper filling influenced by the additives and electroplating process
1年前
已完结
FEA study on the TSV copper filling influenced by the additives and electroplating process
1年前
已关闭
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