Lv2
196 积分 2022-03-17 加入
Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding
11天前
已完结
Single-additive TSV filling achieved with a tris-ammonium-based suppressor
22天前
已完结
Evolution Kinetics of Voids in Electroplated Cu-Cu Wafer Bonding
3个月前
已完结
Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias
3个月前
已完结
Investigation of Bottom-Up Electrodeposition Filling for Nanoscale Through-Silicon Vias (TSVs)
7个月前
已完结
Effect of Superfilling and Leveling Inhibitors in Hybrid Additives on the Microstructure Evolution of Electroplated Copper Interconnect Films during Self-Annealing
7个月前
已完结
Magnetic–enzymatic synergy driven photoelectrochemical aptasensor on a microfluidic chip for sub-pM kanamycin detection
8个月前
已完结
Magnetic–enzymatic synergy driven photoelectrochemical aptasensor on a microfluidic chip for sub-pM kanamycin detection
8个月前
已完结
FEA study on the TSV copper filling influenced by the additives and electroplating process
9个月前
已完结
FEA study on the TSV copper filling influenced by the additives and electroplating process
9个月前
已关闭
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