Lv6
2400 积分 2024-04-15 加入
Integrated Assembly Process For Pluggable Fiber Connector For Co-Packaged Optics
2个月前
已完结
An Optical Engine with both EIC and PIC Embedded in Mold Compound in FOWLP
4个月前
已完结
An Optical Engine with both EIC and PIC Embedded in Mold Compound in FOWLP
4个月前
已完结
Cost-effective, high-performance heterogeneous integration for 6.4T and beyond 224Gbps/lane co-packaged-optical engines for AI/ML and data center
4个月前
已完结
A review of laser ablation and dicing of Si wafers
6个月前
已完结
Development of chip-on-chip with face to face technology as a low cost alternative for 3D packaging
6个月前
已完结
Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun
6个月前
已完结
Efficient Scalable Thermoelectric Modeling of High-Frequency Cylindrical Interconnects for Heterogeneous Package Arrays
6个月前
已完结
Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package
6个月前
已完结
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
6个月前
已完结
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