Lv64
1700 积分 2024-04-15 加入
A review of laser ablation and dicing of Si wafers
30天前
已完结
Development of chip-on-chip with face to face technology as a low cost alternative for 3D packaging
1个月前
已完结
Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun
1个月前
已完结
Efficient Scalable Thermoelectric Modeling of High-Frequency Cylindrical Interconnects for Heterogeneous Package Arrays
1个月前
已完结
Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package
1个月前
已完结
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
1个月前
已完结
3D FOWLP Integration
1个月前
已完结
Process integration of 3D Si interposer with double-sided active chip attachments
1个月前
已完结
Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips
1个月前
已完结
Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates
1个月前
已完结
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