Lv61
2530 积分 2024-04-15 加入
A $\mathbf{3 2 G b} / \mathbf{s}$ Optical Receiver Utilizing a Differential TIA with $- 1 7. 3 d B m$ Sensitivity in a 3D-Stacked Silicon Photonics Platform
4小时前
已完结
Low Temperature In-PI Hybrid Bonding for Temperature-Sensitive 3D Heterogeneous Device Integration
6小时前
已完结
Enabling Die-to-Wafer (D2W) Hybrid Bonding via Laser Stealth Dicing Technology
8小时前
已完结
Potential Applications of Cu-Cu Hybrid Bonding to Chiplets Heterogeneous Integration
3天前
已完结
Co-packaged optics for high-performance computing and artificial intelligence
3天前
已完结
Integrated Assembly Process For Pluggable Fiber Connector For Co-Packaged Optics
4个月前
已完结
An Optical Engine with both EIC and PIC Embedded in Mold Compound in FOWLP
5个月前
已完结
An Optical Engine with both EIC and PIC Embedded in Mold Compound in FOWLP
5个月前
已完结
Cost-effective, high-performance heterogeneous integration for 6.4T and beyond 224Gbps/lane co-packaged-optical engines for AI/ML and data center
6个月前
已完结
A review of laser ablation and dicing of Si wafers
7个月前
已完结
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