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980 积分 2025-01-23 加入
Corrigendum: Investigating GaN/SiC Hybrid Field-Effect Transistor Designs for Simplified Fabrication Process and Improved Performance [ECS J. Solid State Sci. Technol., 14, 111002 (2025)]
48分钟前
已完结
Corrigendum: Investigating GaN/SiC Hybrid Field-Effect Transistor Designs for Simplified Fabrication Process and Improved Performance [ECS J. Solid State Sci. Technol., 14, 111002 (2025)]
2天前
求助中
Control of etch profiles in high aspect ratio holes via precise reactant dosing in thermal atomic layer etching
21天前
已完结
Etch of nano-TSV with smooth sidewall and excellent selection ratio for backside power delivery network
23天前
已完结
High aspect ratio silicon etch: A review
23天前
已完结
Si-based MEMS resonant sensor: A review from microfabrication perspective
23天前
已完结
Chiplet Design and Heterogeneous Integration Packaging
27天前
已完结
Overview and outlook of through‐silicon via (TSV) and 3D integrations
1个月前
已完结
Through-silicon Via Advanced Packaging Technology and Its Radio Frequency Applications
1个月前
已完结
Control of etch profiles in high aspect ratio holes via precise reactant dosing in thermal atomic layer etching
1个月前
已完结
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