Lv5
1060 积分 2025-01-23 加入
Mechanism of SiOx particles formation during CVD graphene growth on Cu substrates
5个月前
已完结
Effects of Cu substrate surface fluctuations on graphene during transfer
6个月前
已完结
Corrigendum: Investigating GaN/SiC Hybrid Field-Effect Transistor Designs for Simplified Fabrication Process and Improved Performance [ECS J. Solid State Sci. Technol., 14, 111002 (2025)]
8个月前
已完结
Corrigendum: Investigating GaN/SiC Hybrid Field-Effect Transistor Designs for Simplified Fabrication Process and Improved Performance [ECS J. Solid State Sci. Technol., 14, 111002 (2025)]
8个月前
已完结
Control of etch profiles in high aspect ratio holes via precise reactant dosing in thermal atomic layer etching
9个月前
已完结
Etch of nano-TSV with smooth sidewall and excellent selection ratio for backside power delivery network
9个月前
已完结
High aspect ratio silicon etch: A review
9个月前
已完结
Si-based MEMS resonant sensor: A review from microfabrication perspective
9个月前
已完结
Chiplet Design and Heterogeneous Integration Packaging
9个月前
已完结
Overview and outlook of through‐silicon via (TSV) and 3D integrations
9个月前
已完结
皖公网安备34019202002308
