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28 积分 2026-01-13 加入
Interaction of Indentation‐Induced Cracks on Single‐Crystal Silicon Carbide
23天前
已完结
New laser slicing technology named KABRA process enables high speed and high efficiency SiC slicing
1个月前
已完结
Nanoindentation insights into intrinsic fracture toughness anisotropy of SiC single crystals and implications for laser-guided fracture propagation
4个月前
已完结
Nanoindentation insights into intrinsic fracture toughness anisotropy of SiC single crystals and implications for laser-guided fracture propagation
4个月前
已完结
MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks
5个月前
已关闭
MHz burst-mode femtosecond laser slicing of n-type 4H-SiC wafer: From initiating to propagating cracks
5个月前
已关闭
A phase field model for rate-independent crack propagation: Robust algorithmic implementation based on operator splits
6个月前
已完结
High-quality laser slicing of single-crystal semiconductors guided by energy-dependent phase transition and crack propagation: A 4H-SiC case study
6个月前
已完结
High-quality laser slicing of single-crystal semiconductors guided by energy-dependent phase transition and crack propagation: A 4H-SiC case study
6个月前
已完结
Polarization dependences of the laser in 4H-SiC wafer slicing
6个月前
已完结
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