Lv31
208 积分 2026-06-10 加入
A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
3小时前
待确认
Laminate Chip Embedding Technology — Impact of Material Choice and Processing for Very Thin Die Packaging
4小时前
已完结
Comparative FEM thermo-mechanical simulations for built-in reliability: Surface mounted technology versus embedded technology for silicon dies
4小时前
已完结
Effects of Viscoelastic-Anisotropic Properties of Prepreg on Diagonal Warpage of Multilayer PCB Substrates
1个月前
已完结
Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging
1个月前
已完结
Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages
1个月前
已完结
Thermal Modeling and Performance of a Bare-Die Embedded PCB for High Power Density Converters Design
1个月前
已完结
A Comparative Analysis of Printed Circuit Boards with Surface-Mounted and Embedded Components under Natural and Forced Convection
1个月前
已完结
Reliability modeling on a MOSFET power package based on embedded die technology
1个月前
已完结
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology
1个月前
已完结
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