| 标题 |
FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies |
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| DOI | |
| 其它 |
期刊:2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 作者:Rainer Dudek; R. Doring; A. Otto; S. Rzepka; S. Stegmeier; et al 出版日期:2017-05-01 |
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(2025-6-4)