Lv7
4730 积分 2022-04-28 加入
Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging
2天前
已完结
Parylene C based memristors for the realization of ultra-thin and flexible smart systems
2天前
已完结
Advanced Materials for Sustainable MEMS: Parylene and Its Multiple Applications in Microsystem Technologies
2天前
已完结
Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications
2天前
已完结
Photolithography process optimization: insights into negative tone resists and spray coating
12天前
已完结
High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process
1个月前
已完结
Inkjet Printing of a Benzocyclobutene-Based Polymer as a Low-k Material for Electronic Applications
1个月前
已完结
Inkjet coating combined with nanoimprinting for complex 3D patterns with nonlinear height and low residual layer
1个月前
已完结
Inkjet coating combined with nanoimprinting for complex 3D patterns with progressive height increase and low residual layer
1个月前
已完结
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