Lv71
4810 积分 2022-04-28 加入
Ultrasonic spray coating combined with maskless lithography for advanced singulation of wafers with complex bump geometry
1小时前
求助中
Adhesive Wafer Bonding Using Ultra-Thin Spray-Coated BCB Layers
9天前
已关闭
(Invited) Parylene C Based Adhesive Bonding on 6” and 8” Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
27天前
已完结
A Review of Mechanism and Technology of Hybrid Bonding
1个月前
已完结
Photo-Definable Dry Film Adhesive and Temporay Bonding De-Bonding Adhesive for Wafer Level Advanced Packaging
1个月前
已关闭
Development Done on Device Bonder to Address 3D Requirements in a Production Environment
1个月前
已关闭
Temporary Wafer Bonding-Key Technology for Mems Devices
1个月前
已关闭
Temporary Wafer Bonding-Key Technology for Mems Devices
1个月前
已关闭
MEMS Fabrication Process
1个月前
已完结
Leaky-dielectric phase field model for the axisymmetric breakup of an electrified jet
5个月前
已完结
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