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Development of a Method for Parylene-Based Interface Toughness Characterization under Fatigue Loads for Electronic Packaging Applications |
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期刊:2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 作者:Carlos Rincon-Ruiz; Martin Kühn; Uwe Zschenderlein; Imants Cirulis; Franz Selbmann; et al 出版日期:2026-04-19 |
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(2025-6-4)