Lv12
60 积分 2025-12-01 加入
Laser-guided anisotropic etching for precision machining of micro-engineered glass components
1天前
已完结
Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection
22天前
已完结
Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits
22天前
已完结
Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering
22天前
已完结
Study of the role of a vitreous enamel layer as a primer in copper-to-glass joints
22天前
已完结
Low Loss Hybrid-Plane PCB Structure for Improving Signal Quality in High-Speed Signal Transmission
22天前
已完结
Enhancing Thermal Conductivity in Low Dielectric Polybutadiene via a Liquid Crystal Ordering Effect
22天前
已完结
Removal mechanism and cleaning method of electroplating masking paint with a microwave plasma jet
26天前
已完结
Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating
26天前
已完结
Electrodeposition of Ni-Fe-based low CTE alloy for void-free through glass via filling to enhance the thermo-mechanical reliability of glass substrate
1个月前
已完结
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