| 标题 |
Enhanced interfacial adhesion strength and reduced warpage of copper electrodeposited epoxy composite substrates by annealing treatment |
| 网址 | |
| DOI | |
| 其它 |
期刊:Surfaces and Interfaces 作者:Shanjun Ding; Man Li; Mengxi Liu; Xiaomeng Wu; Chuan Chen; et al 出版日期:2026-03-01 |
| 求助人 | |
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(2025-6-4)