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34 积分 2023-04-03 加入
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
1天前
已完结
Co-packaging optics technology and its standardization of intelligent computing center in the AI era: status and prospect
1天前
已完结
1S1R Resistive Switching of Pt/NbOx/Pt Memristive Devices Achieved by Intercalating Nb Thin Layer and Annealing
3天前
求助中
A millimeter-wave substrate integrated waveguide filtering antenna loaded with C-shaped slot
6天前
已完结
Lunar Lake an Intel Mobile Processor: SoC Architecture Overview (2024)
16天前
已完结
3D integrated 45 W peak power 2D addressable VCSEL array and laser driver for true solid-state LiDAR
1个月前
已完结
3D integrated 45 W peak power 2D addressable VCSEL array and laser driver for true solid-state LiDAR
1个月前
已完结
Column-addressable and matrix-addressable multi-junction VCSEL arrays for all electronic-scanning LiDAR
1个月前
已完结
Heterogeneous integration of VCSELs on 3 µm SOI silicon photonics platform with up-reflecting mirrors
1个月前
已完结
The role of VCSELs in 3D sensing and LiDAR
1个月前
已完结
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