| 标题 |
Microstructural characteristics of immersion tin coatings on copper circuitries in circuit boards |
| 网址 | |
| DOI | |
| 其它 |
期刊:Surface and Coatings Technology 作者:Yen-Heng Chen; Yung-Yun Wang; Chi-Chao Wan 出版日期:2007-12-01 |
| 求助人 | |
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(2025-6-4)