| 标题 |
Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials |
| 网址 | |
| DOI | |
| 其它 |
期刊:ACS Applied Materials & Interfaces 作者:Jiashuo Sheng; Zhian Zhang; Yunsong Pang; Xiaxia Cheng; Chen Zeng; et al 出版日期:2024-10-29 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)