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Sucrose-Assisted Interface Engineering of Boron Nitride for BT-Based High-Frequency Electronic Packaging Substrates with Low Dielectric Loss and Enhanced Thermal Conductivity |
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期刊:ACS Applied Materials & Interfaces 作者:Hao Wang; Yuxin He; Kang Luo; Enzhu Li; Bin Tang; et al 出版日期:2026-09-03 |
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(2025-6-4)