| 标题 |
Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating |
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| 其它 |
期刊: 作者:Guanqun Hu; Rupeng Li; Wanda Liao; Changning Bai; Xingkai Zhang; et al 出版日期:2024-04-24 |
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(2025-6-4)