| 标题 |
Demonstration of an Optical Packaged Substrate with Embedded Silicon Photonic Transceiver for High Performance Chiplet Packaging |
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| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Fumi Nakamura; Akihiro Noriki; Kenta Suzuki; Satoshi Suda; Haruhiko Kuwatsuka; et al 出版日期:2026-05-26 |
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(2025-6-4)