| 标题 |
 Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder |
| 网址 | |
| DOI |
10.1115/ipack2019-6563
doi
|
| 其它 |
期刊：ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者：S. M. Kamrul Hasan; Abdullah Fahim; Jeffrey C. Suhling; Sa’d Hamasha; Pradeep Lall 出版日期：2019-12-10 |
| 求助人 | |
| 下载 | 求助已完成，仅限求助人或该文件上传人下载。 |
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