| 标题 |
Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Science in Semiconductor Processing 作者:Jeong-Hyeon Baek; Dong-Woon Park; Gyung-Hwan Oh; Dong-Ok Kawk; Simon S. Park; et al 出版日期:2022-09-01 |
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(2025-6-4)