| 标题 |
Synchronously Enhancing Through-Plane Thermal Conductivity and Near-Field Electromagnetic Interference Shielding Effectiveness of Aligned-Graphite Composites for Advanced Microelectronic Packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Small 作者:Shengqiang Zhang; Yong Wang; Fukang Deng; Dingkun Tian; Ya-dong Xu; et al 出版日期:2025-04-13 |
| 求助人 | |
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(2025-6-4)