| 标题 |
 Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application |
| 网址 | |
| DOI |
10.1115/ipack2024-140613
doi
|
| 其它 |
期刊：ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者：Heungdong Kwon; Daeyoung Kong; Hyoungsoon Lee; James Palko; Ercan M. Dede; et al 出版日期：2024-10-08 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)
梁静茹给我的勇气
张欢馨
Kao
Criminology34
ansteel
woshi123
catank
东方元语
cdercder
dde
GingerF
学术孤儿
carne
ASSA
实验室
可靠铸海
aajhajkahna
lili
挣积分换文献的大飞
OK
皖公网安备34019202002308
