| 标题 |
Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics |
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| DOI | |
| 其它 |
期刊:Advanced Powder Technology 作者:Yang Zuo; Sadie Carter-Searjeant; Mark Green; Liam Mills; Samjid H. Mannan 出版日期:2020-09-11 |
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(2025-6-4)