| 标题 |
Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Journal of Emerging and Selected Topics in Power Electronics 作者:Meiyu Wang; Y. Mei; Weibo Hu; Xin Li; G. Lu 出版日期:2022-04-01 |
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(2025-6-4)