| 标题 |
Cross-Scale Finite Element Analysis of PCBA Reflow Soldering Processes |
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| DOI | |
| 其它 |
期刊:2024 25th International Conference on Electronic Packaging Technology (ICEPT) 作者:Ruiqian Zheng; Wenqian Li; Mengxuan Cheng; Nan Sheng; Hao Zheng; et al 出版日期:2024 |
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(2025-6-4)