| 标题 |
 Process Development and Thermal Characterization of Micropillar Direct-to-Silicon Liquid Cooling Solution on CoWoS-R Platform |
| 网址 | |
| DOI | |
| 其它 |
求助全文 PDF，谢谢！ DOI: 10.1109/ECTC51846.2026.00092 标题: Process Development and Thermal Characterization of Micropillar Direct-to-Silicon Liquid Cooling Solution on CoWoS-R Platform 作者: Sing-Da Jiang; Chun-Yu Ou; Chi-Shiang Chiou; Yu-Sheng Tsai; Chang-Yi Tsai; Chuan-Chang Wu; Tsun-Yen Wu; Ying-Ju Chen; Wen-Hsiung Lu; Tzong-Huann Yang; Ren-Yu Chang; Kathy Yan 期刊: 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 年份: 2026 |
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(2025-6-4)
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