| 标题 |
Phosphononitrile based bismaleimide electronic packaging substrate with both fire safety and dielectric properties: Assisting 5G communication |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Part B: Engineering 作者:Yifan Zhou; Wenbin Ye; Wei Liu; Fukai Chu; Weizhao Hu; et al 出版日期:2024 |
| 求助人 | |
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(2025-6-4)