| 标题 |
Effect of Cu substrate surface modification on wettability and interfacial reaction of tin-based lead-free composite solder |
| 网址 | |
| DOI | |
| 其它 |
期刊:Welding in the World 作者:Hui-Gai Wang; Yu-Hui Zhao; Ke-Ke Zhang; Meng Zhang 出版日期:2026-08-18 |
| 求助人 | |
| 下载 |
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(2025-6-4)