| 标题 |
Exploring blockchain and artificial intelligence in intelligent packaging to combat food fraud: A comprehensive review |
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| DOI | |
| 其它 |
期刊:Food Packaging and Shelf Life 作者:Yadong Yang; Yating Du; Vijai Kumar Gupta; Fisal Ahmad; Hamid Amiri; et al 出版日期:2024-04-22 |
| 求助人 | |
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(2025-6-4)